The plate thickness can be done from 0.4mm-10.0m.
1OZ copper thickness 0.15mm, 2OZ, 3OZ, 4OZ copper thickness 0.4mm pitch.
The aperture of glass fiber material > 0.15mm, the minimum aperture of aluminum substrate, copper substrate and copper aluminum composite board is >1.2mm
The withstand voltage of the amount substrate can be AC1500-AC4000V
The thermal conductivity of aluminum substrate and copper substrate is generally 1W/m.k, 2w/m.k 3W/m.k, 5W/m.k, 8W/m.k, and the thermal conduction of thermoelectric separation can be 380W/m.k
