The material of the circuit board can be made into aluminum-based, copper-based, FR4 glass fiber, CEM-3.
Fiberglass board to do 1-24 layers, aluminum substrate and copper substrate and copper-aluminum composite board can do 1-4 layers,
he copper thickness of the circuit board is made 1OZ, 2OZ, 3OZ 4OZ.
The plate thickness can be done from 0.4mm-10.0m.
1OZ copper thickness 0.15mm, 2OZ, 3OZ, 4OZ copper thickness 0.4mm pitch.
The aperture of glass fiber material > 0.15mm, the minimum aperture of aluminum substrate, copper substrate and copper aluminum composite board is >1.2mm
